la268b/y-1-pf doc. no : qw0905-la268b/y-1-pf rev. : a date : 01- jul. - 2008 data sheet led array lead-free parts ligitek electronics co.,ltd. property of ligitek only pb
4.4 0.5 typ 3.3 2.54typ 5.85 0.5 ly2640-1-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. + _ package dimensions part no. la268b/y-1-pf ligitek electronics co.,ltd. property of ligitek only 6.0 2.9 0.5 7.8 ? 3.1 2.5 4.0 7.0 3.5 0.5 ? 0.95 ? 4.1 2.9 page 1/5 + - 1.5max 4.3 3.3 0.5 typ 2.54typ 1.0min 25.0min 2.9 3.1
symbol i f i fp pd absolute maximum ratings at ta=25 t opr tstg color typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. operating temperature part nomaterial emitted storage temperature forward current reverse current @5v peak forward current duty 1/10@10khz power dissipation parameter -40 ~ +85 viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) peak wave length pnm spectral halfwidth nm forward voltage @ ma(v) typ. 12 35 585 lens 8.0 max. min.min. 50 -40 ~ +100 page ma 20 ir10 60 80 a ma mw ratings y unit ligitek electronics co.,ltd. property of ligitek only la268b/y-1-pf yellow gaasp/gap yellow diffused 1.7 2.6 20 2/5 part no. la268b/y-1-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip page3/5 part no. la268b/y-1-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) if holder-set operation pcb 0.5 mm above holder expor be explain that holder press-tep : 120 max. 5 /sec max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 0 0 preheat 50 25 120 2 /sec max 100 time(sec) 150 temp( c) 260 260 c3sec max ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 2.wave soldering profile page 4/5 part no. la268b/y-1-pf
mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs thermal shock test solder resistance test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. page mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition test item reliability test: description reference standard ligitek electronics co.,ltd. property of ligitek only 5/5 part no. la268b/y-1-pf
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